PCB fixation:
Max PCB Size: 450x450 mm (optional 450х350 mm)
Min PCB Size: 8x8 mm
PCB fixation: edge
Component Specification:
Component Size: from 2х2mm to 60х60mm
Minimum BGA Ball pitch: 0.3 mm
Mounting precicion: +/- 0.03 mm
Heating System:
Bottom infrared heater power: 4200 W (400х350 mm)
Lower heater power + convection: 1200 W
Upper heater power + convection: 800 W
Type thermocouple
PID temperature control
Machine Specification:
Machine Dimensions(LхWхH): 1000х880х990 mm
Wheight: 105 kg
Main Power Source and Total Power Consumption:
Power supply: 220 V土 10%, 50/60 Hz, 6.4 kW
System operation video