PCB fixation:
Max PCB Size: 615x480 mm (optional - 550х380 mm)
Min PCB Size: 8x8 mm
PCB fixation: edge
Component Specification:
Component Size: from 2х2 mm to 60х60 mm
Minimum BGA Ball pitch: 0.3 mm
Mounting precicion: +/- 0.01 mm
Heating System:
Bottom infrared heater power: 7200 W (540х420 mm)
Lower heater power + convection: 1200 W
Upper heater power + convection: 1200 W
K-Type thermocouple
PID temperature control
Machine Specification:
Machine Dimensions(LхWхH): 890х940х1000 mm
Wheight: 140 kg
Main Power Source and Total Power Consumption:
Power supply: 380 V 土 10%, 50/60 Hz, 9,7 kWSystem operation video