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Reflow soldering

Reflow Ovens

Ovens for soldering printed circuit boards are divided into several categories: from desktop chamber-type systems to conveyor systems, with many zones of upper / lower heating and cooling

Temperature recorders (Thermoprofilers)

Devices for registering the thermal profile in the chambers of ovens for the purpose of its subsequent analysis and perfect adjustment of the temperature environment when soldering printed circuit boards
PCB soldering is done in flux reflow ovens. Ovens heating methods are classified in infrared (IR) and convection. Depending on manufacture requirements, offers desktop chamber ovens, as well as linear oven with chain and mesh conveyors with a different number of heating and cooling  zones, as well as a wide range of options (soldering in nitrogen environment with using the level of oxygen analyzer, water cooling (internal or external), non-standard components soldering and more
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