PCB fixation:
Max PCB Size: 500x450 mm
Min PCB Size: 10x10 mm
PCB fixation: edge
Component Specification:
Component Size: from 0.6 mm to 8 mm
Minimum BGA Ball pitch: 0.15 mm
Mounting precicion: +/- 0.01 mm
Heating System:
Bottom infrared heater power: 4200 W
Lower heater power + convection: 1200 W
Upper heater power + convection: 1200 W
K-Type thermocouple (4 pcs)
PID temperature control +/- 1ºС
Machine Specification:
Machine Dimensions(LхWхH): 670х780х850 mm
Weight: 90 kg
Main Power Source and Total Power Consumption:
Power supply: 220 V土 10%, 50/60 Hz, 6,8 kW