AOI 3D linear system, ATHENA 3D 8800, 8800HS, 8800PRO models

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AOI 3D linear system, ATHENA 3D 8800, 8800HS, 8800PRO models

Manufacturer Pemtron
Model ATHENA_8800

Description

PCB dimensions: from 50x50 mm to 330x330 mm (optionally 510x510 mm)
Height of inspected components: 0-5.5 mm (optionally up to 27 mm)
Camcorder: 4MP, 9MP (8800HS), 12MP (8800PRO)
Camcorder Resolution: 10, 15 or 18 μm

Features:
  • 8 projections and 3-level lighting system
  • 2D and 3D Inspection Algorithms
  • Telecentric lens provides high accuracy and probability of defects detection
  • Shadowless 3D High Component Inspection
  • 3D measurement of the height of the solder joint and the component housings / leads
  • 4 corner camcorders (optional)
  • Text recognition (3 different algorithms)
  • Recognition of the findings and their coplanarity
  • Powerful CPU and high speed image processing
  • Simple and convenient graphical interface
  • Integrated Library Management System

Gallery

Specification

PCB dimensions: from 50x50 mm to 330x330 mm (optionally 510x510 mm)

Height of inspected components: 0-5.5 mm (optionally up to 27 mm)

Camcorder: 4MP, 9MP (8800HS), 12MP (8800PRO)

Camcorder Resolution: 10, 15 or 18 μm

 

Inspection speed:

-camera 4MP, 10 μm: 9.1 sm2/sec

-camera 4MP, 15 μm: 20.5 sm2/sec

-camera 4MP, 18 μm: 29.5 sm2/sec

-camera 9MP, 10 μm: 18 sm2/sec

-camera 9MP, 15 μm: 40.5 sm2/sec

-camera 9MP, 18 μm: 58.3 sm2/sec

-camera 12MP, 15 μm: 52.65 sm2/sec


Camera field of view (FOV):

-camera 4MP, 10 μm: 20х20 mm

-camera 4MP, 15 μm: 30х30 mm

-camera 4MP, 18 μm: 36х36 mm

-camera 9MP, 10 μm: 30х30 mm

-camera 9MP, 15 μm: 45х45 mm

-camera 9MP, 18 μm: 54х54 mm

-camera 12MP, 15 μm: 45х60 mm


Max. PCB warpage: +/- 3 mm

PCB thickness: 0.4-7 mm

Clearance above/below PCB: 50/50 mm

Operation system: Windows 7, 64 bit

Power supply: 1ph 220V, 50/60HZ, 3.5 kW

Dimensions: 1010х1190х1600 mm

Weight: 750 kg

Video

PCB rotate function

Improved Z axis functionality

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