Solder paste and glue dispensers
Compared with screen printing, dispersing method having several number of features:
+ rapid transition to new products manufacturing
+ high accuracy of content quantity of pasta in a single dose
+ fully controllable paste consumption
- low application rate
- specific requirements to the type of used pasta (grade 5 and above)
- extended maintenance time of equipment (dispensing unit)
In addition to applying paste dispensers are also used for glue application prior SMD-components mounting.
Glue/paste applying in most cases is necessary to further strengthen the fastening components to the surface of the PCB.
Basically it is position components, or components used in the printed circuit that will work under extreme conditions.
Operation speed, degree of automation of the process and the accuracy of applying material, dispensers are divided into 4 types:
- desktop automatic
- linear medium speed
- linear high-speed (jet printers)